Precision Wire Sinker E. D. M Cutting Tooling Smart Metal Tungsten Carbide Stamping Bar Cut Die for The Semiconductor Industry

Get high-precision wire sinker E.D.M cutting tooling for the semiconductor industry from our factory. Our smart metal tungsten carbide stamping bar cut die ensures top quality.
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PRODUCTS DETAILS

  • Overview
  • Company Profile
  • Product Description
  • Our Advantages
  • Certifications
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
B0220005
Material
F10 Vf12 Kd20 F20 H40s H25s
Application
Electronic, Hardware, Machinery, Car, High Speed Press Stamping
Certification
ISO9001:2015
Carbide Source
Everloy,Fujilloy,Ceratizit,Kenna
Tolerance
+/-0.002mm
Surface Finish
0.3-0.4 Micron
Coating
Tin Dlc Titanium
Transport Package
Cartons or Wooden
Trademark
SUNDI
Origin
Wuxi China
HS Code
8207300090
Production Capacity
50000/PCS Year

Packaging & Delivery

Package Size
10.00cm * 10.00cm * 10.00cm
Package Gross Weight
0.200kg

Product Description


 
Company Profile

Precision Wire Sinker E. D. M Cutting Tooling Smart Metal Tungsten Carbide Stamping Bar Cut Die for The Semiconductor Industry

Product Description

 

Precision Wire Sinker E. D. M Cutting Tooling Smart Metal Tungsten Carbide Stamping Bar Cut Die for The Semiconductor Industry

Precision Wire Sinker E. D. M Cutting Tooling Smart Metal Tungsten Carbide Stamping Bar Cut Die for The Semiconductor Industry
Precision Wire Sinker E. D. M Cutting Tooling Smart Metal Tungsten Carbide Stamping Bar Cut Die for The Semiconductor Industry
Part Name
Custmized forming punch,punch and die ,die components
Manufacturing process
Machining Center/CNC lathes/Surface Grinding machines/Milling Machines/Wire-cuts/CNC bearing Machines/ Cylindrical Grinding
Machines/ Profile Grinding,E.D.M machines/Etc .
Materials:
Tungsten Carbide:F10,H40S,H25S,G4,KD20/etc
 ASSAB :ASP23,XW42,EM2,718HH/etc
Japanese:HPM2,NAK80,SKD61,SKS3,SKD11,DC53,SKH51/etc
SCHMOLD:1.2379,1.3343,1.2990
Surface Treatment
Blacking/Chrome/Zincplating/DLC/TICN/Oxidation Treatment.
QC
100% inspection before delivery
Payment
30% in advance,70% before shipment.Samples 100% with order
 
Our Advantages

 

Precision Wire Sinker E. D. M Cutting Tooling Smart Metal Tungsten Carbide Stamping Bar Cut Die for The Semiconductor Industry Precision Wire Sinker E. D. M Cutting Tooling Smart Metal Tungsten Carbide Stamping Bar Cut Die for The Semiconductor Industry

 

Certifications

 

Precision Wire Sinker E. D. M Cutting Tooling Smart Metal Tungsten Carbide Stamping Bar Cut Die for The Semiconductor Industry
Packaging & Shipping

Precision Wire Sinker E. D. M Cutting Tooling Smart Metal Tungsten Carbide Stamping Bar Cut Die for The Semiconductor Industry

FAQ

Precision Wire Sinker E. D. M Cutting Tooling Smart Metal Tungsten Carbide Stamping Bar Cut Die for The Semiconductor Industry

CAN YOU MAKE THE CUSTOMIZED PARTS?

Of course, we also take the design for clients and make the special parts and mold, satisfied with customers of high quality.

HOW ABOUT THE LEAD TIME?

The lead time is based on the quantity and complexity of the ordering tools. it's normal for 10-20 days, If urgent,
we'll arrange the production with top priority to reduce lead time.

DO YOU KEEP A STOCK OF YOUR PRODUCTS?

We will stock for the regular ordering parts, for the customized product we need to machine them according
to special requirements.

CAN YOUR ENGINEER JOIN OUR PROGRAM DESIGN

We're very pleased to be working with you, we can offer our idea and design.

IS THERE A PRICE LIST?

Feel free to contact our sales to get the last price list and offer.
 

Contact us

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